Symposium Topics

SPECIAL TOPIC AREAS

Automotive
Intentional EMI and Cybersecurity
Wireless (co-site EMI, 5G)
Robotics
Model Based Engineering

 

TECHNICAL AREAS

The IEEE EMC Society’s Technical and Special Committees encompass most but not all of the possible topics of interest. These Committees are responsible for sponsoring Symposium content and reviewing papers within their scope. The Committees, their scopes, and their primary topics of interest are listed below:

 

TC-1 EMC Management

  • Personnel & Laboratory Accreditation
  • EMC Education
  • Legal Issues

TC-2 EMC Measurements

  • Test Instrumentation & Facilities
  • Measurement Techniques
  • Standards and Regulations
  • Measurement Uncertainty

TC-3 EM Environment

  • EM Signal Environment
  • Atmospheric & Man-Made Noise
  • Characterization of the EM environment

TC-4 EM Interference Control

  • Shielding, Gasketing & Filtering
  • Cables and Connectors
  • Circuit & System EMC Analysis
  • Grounding
  • PCB Layout

TC-5 High Power Electromagnetics

  • ESD & Transients
  • EMP, IEMI & Lightning
  • Information Leakage
  • Electric Power EMC

TC-6 Spectrum Engineering

  • Spectrum Characterization and Modeling
  • Design for Spectrally Efficient Systems
  • Adaptive Interference Mitigation

TC-7 Low Frequency EMC

  • Power Quality and Power System EMC
  • Conducted Emissions Due to Power Converters
  • Transportation and Electrical Vehicles
  • Renewables and Smart Grid
  • Topics for Future Standardization

TC-8 Aeronautics and Space EMC

  • Aircraft
  • Atmospheric environment
  • Drones (Unmanned Aerial Vehicles)
  • Spacecraft
  • Space Environment
  • Launch Vehicles
  • Missiles
  • Other Aerospace Topic

TC-9 Computational Electromagnetics

  • Computer Modeling and Circuit Simulation Methods
  • Multi-Physics Techniques, Tools and Applications
  • SI/PI/EMC Co-Simulation
  • Best Practice and Validation Methods
  • Surrogate Modeling and Optimization Techniques
  • Design of Experiments (DoE) and Statistical Analysis

TC-10 Signal and Power Integrity

  • High-Speed Interconnects
  • Device Modeling & Characterization
  • Crosstalk, Jitter, Noise Coupling, BER Analysis
  • 3D IC & TSV
  • Power Distribution Networks & Decoupling
  • SI/PI/EMI Co-Design
  • Simulation and Modeling Techniques
  • Chip-level Advanced Packaging
  • Topics for Future Standardization

TC-11 Nanotechnology & Advanced Materials

  • Nanomaterials & Nanostructures
  • Smart Materials
  • Topics for Future Standardization

TC-12 EMC for Emerging Wireless Technologies

  • EMC Planning/Testing/Specifications
  • Wireless Coexistence
  • Intra-System Interference
  • RF Desense

SC-1 Smart Grid EMC

  • Renewable Generation
  • Grid Communications

SC-5 Power Electronics EMC

  • AC/DC, DC/DC, DC/AC and AC/DC Power Conversion
  • Passive Components and Semiconductor Devices
  • Automotive, Aerospace, and Communication Systems, Wireless Power Transfer
  • Wireless Power Transfer
  • Medical, Aviation, Consumer Electronics and Power Applications
  • Topics for Future Standardization